The benefits of X-ray inspection around AoI inspection!

The X Ray inspection machine can absolutely verify out the following shortcomings:

The x-ray machine's high repeatability accuracy serves to boost production. The unique angle for sample inspection also makes it suitable for mass testing.

Defect inspection in IC encapsulation, e.g.: layer separation, cracking, void, and line integrity.

Measuring chip dimension, measuring line curvature, measuring the proportion of solder space of elements.

Achievable defects in PCB production processes, e.g.: misalignment, solder bridge and open.

SMT solder small, chilly solder, Wrong Solder, part shifted, solder insufficient, solder void inspection and measurement.

Defect inspection of open, short or irregular connections that will come about.

Due to the fact AOI is topic to factors such as light, angle, resolution and so forth, the subsequent shortcomings can only be checked below particular situations, nonetheless it is hard to accomplish 100% detection amount.

Mistaken ingredient

Mistaken polarity

Guide lift, guide defective

Solder bridge

Insufficient solder

Fake Solder, Cold Solder

In short, although AOI is not hard to utilize, it does have some inherent constraints. However, it's used for preliminary high quality evaluation of SMT, and immediately feed-back the quality status of SMT and increases it, which often can properly enhance the output of SMT.

Usually, using an ICT tester to resolve the condition and afterwards reacting to SMT is usually a time difference following 24 hrs. At that time, SMT problems commonly transformed, and in many cases the strains improved.

In addition, while using the growth of technological innovation along with the improvement of MCU computing energy, a lot of SMT makers presently have AOI products. In an effort to assure large quality, it's essential to have MES x ray inspection machine.

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